Abstract: In order to introduce fluorine-containing functional groups into the epoxy resin to improve the electrical properties of the epoxy film surface, a film preparation method is proposed. Firstly, 2,2-bis(4-hydroxyphenyl)-hexafluoropropane, benzyltrimethylammonium chloride and epichlorohydrin are selected to prepare a trifluoromethyl-containing bisphenol A diglycidyl ether(F-DGEBA) monomer by mixing and reaction, and then the fluorinated monomer and bisphenol A diglycidyl ether(DGEBA) are mixed according to different ratios, the fluorinated monomers are 0%, 20%, 40%, 60%, 80% and 100%, and finally fluorinated epoxy films are obtained by high temperature curing of the mixture using methyl tetrahydrophthalic anhydride(MTHPA). The chemical structure of the prepared fluorinated films is confirmed by NMR spectroscopy and their deionized water contact angles are obtained using a contact angle tester. A metal dust discharge test rig and a surface potential decay test rig are also developed to investigate the surface insulation and dielectric properties of the fluorinated films. The results show that the contact angle of the fluorinated films increases significantly with the increase of the proportion of F-DGEBA monomer, and the surface hydrophobicity is significantly improved; the distribution of deep and shallow traps of the fluorinated films is also changed, which leads to the enhancement of the surface insulating strength and potential attenuation properties. Compared with the non-fluorinated film, the surface flashover voltage of the fluorinated film can be increased by up to 32.2% and its potential attenuation is faster; the flashover voltage of the fluorinated film changes less after repeated creepage discharges, and the insulation strength is more stable. Therefore, this proposed method can be used to quickly and easily prepare epoxy resin insulating materials with good hydrophobic, insulating and charge dissipation properties, and has good prospects for industrial applications.