大数据驱动的晶圆工期预测关键参数识别方法

Big Data Driven Key Factor Identification for Cycle-time Forecasting of Wafer Lots in Semiconductor Wafer Fabrication System

  • 摘要: 工期是晶圆制造中的重要性能指标,对其进行精准预测可促进系统运行优化,保证订单的准时交付率。针对晶圆工期影响参数多、数据体量大且作用机理复杂的特点,提出数据驱动的晶圆工期关键参数过滤方法,识别影响晶圆工期波动的关键参数。分析晶圆工期潜在影响参数,构建候选参数集;基于信息熵方法设计关键参数的入选测度,综合度量参数间的相关性、冗余性与互补性;提出过滤式的关键参数识别算法,滤取影响工期波动的关键参数子集。采用实例数据,从1 202个候选参数中过滤得到78个关键参数,并采用神经网络模型进行工期预测,结果表明,该方法在预测精度和稳定性上都优于采用全局参数的多元线性回归与神经网络方法。

     

    Abstract: The semiconductor wafer fabrication system (SWFS) should make changes on the product mix and manufacturing process control frequently to meet customers' fluctuating demands, and the cycle time (CT) forecasting is crucial in the promise of a good delivery-time. A data driven method is proposed to select key factors by estimating the correlation between candidate factors and wafer lots' CT. Firstly, all candidate factors are collected for correlation analysis. Subsequently, a mutual information based method is designed to determine key factors as the input of the forecasting model. Eventually, 78 CT-related factors stood out from 1 202 candidates and replaced 5 global factors (used as reference) to predict CTs of wafer lots. To evaluate the performance, a back propagation network is designed to forecast the CT of wafer lots by using the selected key factors. The results indicate that the proposed approach had higher accuracy than linear regression and FCM-BPN in CT forecasting in large scale dataset.

     

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